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・ Thermal energy storage
・ Thermal engineering
・ Thermal entrance length
・ Thermal equator
・ Thermal equilibrium
・ Thermal expansion
・ Thermal expansion coefficients of the elements (data page)
・ Thermal expansion valve
・ Thermal fade
・ Thermal fluctuations
・ Thermal fluids
・ Thermal fracturing in glass
・ Thermal grease
・ Thermal grill illusion
・ Thermal Hall effect
Thermal Head
・ Thermal history coating
・ Thermal history modelling
・ Thermal history of the Earth
・ Thermal hydraulics
・ Thermal hydrolysis
・ Thermal imaging camera (firefighting)
・ Thermal immersion circulator
・ Thermal infrared spectroscopy
・ Thermal insulation
・ Thermal integrity profiling
・ Thermal ionization
・ Thermal ionization mass spectrometry
・ Thermal keratosis
・ Thermal lag


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Thermal Head : ウィキペディア英語版
Thermal Head

==Description==
The Thermal Head is a component of a metrological device created to aid in development of new CPUs and chipsets. The first Thermal Head was constructed in 1996 by James Kerner. It was initially designed to control a slot 1 Intel processor's temperature while making computations in a test platform. A Thermal Head attached to a CPU may also increase a CPU's performance during computation. Today it is used for test/validation of a processor in conjunction with a Thermal Management System consisting of a temperature controller attached to the Thermal Head by way of an electrical umbilical.
A Thermal Head is always used in conjunction with a Thermal Tool System. "Among the USTC Thermal Tool System products are the Integrated Thermal Management System (ITMS), Hybrid Air Thermal Management System (HATMS), Rack Integrated Thermal Management System (RITMS), Temperature Control System (TCS), and Thermal Heads (TH). Integrating cooling modules and the TCS in one enclosure with liquid as working fluid, combined with TH, the ITMS executes temperature control tasks without other components. Using air as cooling media, the HATMS executes the tasks like ITMS. The RITMS includes a smart TCS unit which automatically adjusts parameters for temperature control, with an ultra-low noise level and low power consumption. The TCS is a standard temperature control unit, and the TH dissipate heat from a heat-generated device, like a computer. The RITMS or TCS, combined with a chiller (or a heat exchanger) and TH, provide a standard way to control the temperature and dissipate heat on electronic components for production validation tests."〔(NASA Spinoff 2007 ), Thermoelectric Devices Advance Thermal Management〕

抄文引用元・出典: フリー百科事典『 ウィキペディア(Wikipedia)
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